Greetings! I am currently a Ph.D. student in the School of Electrical and Computer Engineering at Purdue University. I earned my M.S. degree from Oakland University in 2022 under the advisement of Prof. Jia Li and Prof. Hongwei Qu. Prior to that, I received my B.E. degree from Beijing Information Science & Technology University (BISTU), Beijing, China, in 2020. Additionally, I spent my senior year as a visiting student at Oakland University in 2020.
Currently, I am serving as a Graduate Research Assistant at the ION research lab, advised by Prof. Christopher G. Brinton. Concurrently, I am actively collaborating with Prof. Ziran Wang. At the moment, my primary research project centers on Multimodal LLM over Network. Please feel free to email me if you have any questions!
- Multimodal Learning
- Mobile Computing
- Internet of Things
Ph.D. in Electrical Engineering, 2026
Purdue University
M.S. in Electrical Engineering, 2022
Oakland University
Visiting Student, 2020
Oakland University
B.E. in Photo-electronic Engineering, 2020
Beijing Information Science & Technology University
News
- Nov 2024: One paper has been accepted to IEEE Journal of Selected Areas in Sensors.
- Jul 2024: I am honored to receive an award from the OpenAI Researcher Access Program.
- May 2024: One paper has been accepted to IEEE Internet of Things Journal.
- Feb 2024: One paper has been accepted to IEEE Internet Computing.
- Jan 2024: One paper has been accepted to ICC 2024. One abstract has been accepted to NAML 2024.
- Nov 2023: One paper has been accepted to IEEE Transactions on Intelligent Vehicles.
- Aug 2023: One paper has been accepted to IEEE Open Journal of Instrumentation and Measurement.
- Jul 2023: One paper has been accepted to ITSC 2023.
- May 2023: One paper has been accepted to IEEE Internet of Things Journal.
- Apr 2023: Two papers have been accepted to the 7th AI City Challenge Workshop at CVPR 2023. I am honored to have been invited as a speaker at IV 2023 IoT in ITS Workshop to present my work in federated learning.
- Mar 2023: One paper has been accepted to IEEE Internet of Things Journal.
- Nov 2022: One paper has been accepted to ICCE 2023.
- Aug 2022: One paper has been accepted to DDDAS 2022. Our paper has been selected as an issue cover.
- Jul 2022: One paper has been accepted to Sensors.
- Nov 2021: One paper has been accepted to IEEE Sensors Journal.
- Aug 2021: One paper has been accepted to IEEE Sensors 2021.
Publications
Presentations
Teaching
Purdue University
Grading Assistant
- ECE 60146 - Deep Learning Spring 2023
- ECE 66100 - Computer Vision Fall 2022
Professional Activities
Journal Reviewer
- IEEE Transactions on Neural Networks and Learning Systems (TNNLS) 2024 – Present
- IEEE Transactions on Wireless Communications (TWC) 2024 – Present
- IEEE Transactions on Network Science and Engineering (TNSE) 2024 – Present
- IEEE Transactions on Pattern Analysis and Machine Intelligence (TPAMI) 2024 – Present
- IEEE Transactions on Network and Service Management (TNSM) 2024 – Present
- IEEE Transactions on Knowledge and Data Engineering (TKDE) 2024 – Present
- IEEE Transactions on Communications (TCOM) 2024 – Present
- IEEE Transactions on Mobile Computing (TMC) 2024 – Present
- IEEE Internet of Things Journal (IoT-J) 2022 – 2024
- ACM Transactions on Intelligent Systems and Technology (TIST) 2024
- IEEE Internet Computing 2024
- IEEE Sensors Letters 2024
- Elsevier Measurement 2024
- IEEE Transactions on Intelligent Vehicles (TIV) 2022 – 2024
- IEEE Transactions on Geoscience and Remote Sensing (TGRS) 2024
- IEEE Transactions on Machine Learning in Communications and Networking (TMLCN) 2024
- Elsevier Engineering Applications of Artificial Intelligence (EAAI) 2024
- SAE International Journal of Connected and Automated Vehicles 2024
- Springer Applied Composite Materials 2023
- ACM on Interactive, Mobile, Wearable and Ubiquitous Technologies (IMWUT) 2023
- IEEE Transactions on Intelligent Transportation Systems (TITS) 2023
- IEEE Access 2023
- IEEE Sensors Journal 2023
Technical Program Committee (TPC) Member/Reviewer
- International Conference on Machine Learning (ICML) 2025
- IEEE International Conference on Communications (ICC) 2024, 2025
- IEEE Conference on Virtual Reality and 3D User Interfaces (IEEE VR) 2025
- International Conference on Artificial Intelligence and Statistics (AISTATS) 2025
- International Conference on Learning Representations (ICLR) 2025
- ACM International Conference on Information and Knowledge Management (CIKM) 2024
- IEEE International Symposium on Embedded Multicore/Manycore SoCs (MCSoC) 2024
- IEEE Sensors Conference 2023, 2024
- Advances in Neural Information Processing Systems (NeurIPS) 2024
- IEEE International Conference on Distributed Computing Systems (ICDCS) 2024
- IEEE International Conference on Computer Communications (INFOCOM) 2024
- IEEE International Conference on Intelligent Transportation Systems (ITSC) 2023
- IEEE International Conference on Mobility: Operations, Services, and Technologies (MOST) 2023
Proposal Reviewer
Contact
- liangqiy@purdue.edu
- BHEE 051, 465 Northwestern Ave, West Lafayette, IN 47907